Granted Patent
Utility
US 4,258,508 · App. 06/072,430
Free hold down of wafers for material removal
Inventors:
Wallace Andrew Wilson, Frank J. Egenski
Patented Case
View Patent ↗
Granted: Mar 31, 1981
Filed: Sep 4, 1979
Inventors
Wallace Andrew Wilson
Frank J. Egenski
Assignee (at issue)
RCA Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.