Granted Patent
Utility
US 4,267,012 · App. 06/034,781
Process for patterning metal connections on a semiconductor structure by using a tungsten-titanium etch resistant layer
Inventors:
John M. Pierce, William I. Lehrer, Kenneth Radigan
Patented Case
View Patent ↗
Granted: May 12, 1981
Filed: Apr 30, 1979
Inventors
John M. Pierce
William I. Lehrer
Kenneth Radigan
Assignee (at issue)
Fairchild Camera & Instrument Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.