Granted Patent
Utility
US 4,298,769 · App. 06/229,193
Hermetic plastic dual-in-line package for a semiconductor integrated circuit
Inventor:
Paul L. Richman
Patented Case
View Patent ↗
Granted: Nov 3, 1981
Filed: Jan 28, 1981
Inventor
Paul L. Richman
Assignee (at issue)
STANDARD MICROSYSTEMS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.