Granted Patent
Utility
US 4,327,399 · App. 06/107,646
Heat pipe cooling arrangement for integrated circuit chips
Inventors:
Etsuro Sasaki, Takaaki Ohsaki
Patented Case
View Patent ↗
Granted: Apr 27, 1982
Filed: Dec 27, 1979
Inventors
Etsuro Sasaki
Takaaki Ohsaki
Assignee (at issue)
Nippon Telegraph and Telephone Public Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.