Granted Patent
Utility
US 4,334,646 · App. 06/141,100
Method of solder reflow assembly
Inventor:
Henry J. Campbell
Patented Case
View Patent ↗
Granted: Jun 15, 1982
Filed: Apr 17, 1980
Inventor
Henry J. Campbell
Assignee (at issue)
HARRIS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.