Granted Patent
Utility
US 4,338,621 · App. 06/118,496
Hermetic integrated circuit package for high density high power applications
Inventor:
Robert E. Braun
Patented Case
View Patent ↗
Granted: Jul 6, 1982
Filed: Feb 4, 1980
Inventor
Robert E. Braun
Assignee (at issue)
Burroughs, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.