Granted Patent
Utility
US 4,349,408 · App. 06/248,038
Method of depositing a refractory metal on a semiconductor substrate
Inventors:
Ming L. Tarng, Walter A. Hicinbothem, Jr.
Patented Case
View Patent ↗
Granted: Sep 14, 1982
Filed: Mar 26, 1981
Inventors
Ming L. Tarng
Walter A. Hicinbothem, Jr.
Assignee (at issue)
RCA Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.