Granted Patent
Utility
US 4,383,270 · App. 06/167,367
Structure for mounting a semiconductor chip to a metal core substrate
Inventor:
Robert L. Schelhorn
Patented Case
View Patent ↗
Granted: May 10, 1983
Filed: Jul 10, 1980
Inventor
Robert L. Schelhorn
Assignee (at issue)
RCA Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.