Granted Patent
Utility
US 4,384,564 · App. 06/227,171
Process of forming a plated wirepack with abrasive particles only in the cutting surface with a controlled kerf
Inventors:
Maynard B. Smith, Frederick Schmid, Chandra P. Khattak
Patented Case
View Patent ↗
Granted: May 24, 1983
Filed: Jan 22, 1981
Inventors
Maynard B. Smith
Frederick Schmid
Chandra P. Khattak
Assignee (at issue)
Crystal Systems Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.