Granted Patent
Utility
US 4,414,045 · App. 06/350,823
High speed ultrasonic bonding
Inventors:
Kenneth Y. Wang, Berlie R. Hill, Marvin J. Pinson, Jr.
Patented Case
View Patent ↗
Granted: Nov 8, 1983
Filed: Feb 22, 1982
Inventors
Kenneth Y. Wang
Berlie R. Hill
Marvin J. Pinson, Jr.
Assignee (at issue)
Burlington Industries LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.