Granted Patent
Utility
US 4,416,054 · App. 06/427,333
Method of batch-fabricating flip-chip bonded dual integrated circuit arrays
Inventors:
Richard N. Thomas, Michael M. Sopira
Patented Case
View Patent ↗
Granted: Nov 22, 1983
Filed: Sep 29, 1982
Inventors
Richard N. Thomas
Michael M. Sopira
Assignee (at issue)
Westinghouse Electric Company LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.