IP Library Granted Patent US 4,419,201
Granted Patent Utility
US 4,419,201 · App. 06/295,531

Apparatus and method for plasma-assisted etching of wafers

Inventors: Hyman J. Levinstein, Frederick Vratny
Patented Case View Patent ↗
Granted: Dec 6, 1983 Filed: Aug 24, 1981
Inventors
Hyman J. Levinstein
Frederick Vratny
Assignee (at issue)
Bell Telephone Laboratories, Inc.

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Quick Facts
Patent No.
US 4,419,201
App. No.
06/295,531
Filed
1981-08-24
Granted
1983-12-06
Kind
A