Granted Patent
Utility
US 4,428,796 · App. 06/404,108
Adhesion bond-breaking of lift-off regions on semiconductor structures
Inventor:
Alvin Milgram
Patented Case
View Patent ↗
Granted: Jan 31, 1984
Filed: Aug 2, 1982
Inventor
Alvin Milgram
Assignee (at issue)
Fairchild Camera & Instrument Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.