Granted Patent
Utility
US 4,437,236 · App. 06/342,715
Solder bonding process
Inventor:
Joseph A. Oswald, Jr.
Patented Case
View Patent ↗
Granted: Mar 20, 1984
Filed: Jan 25, 1982
Inventor
Joseph A. Oswald, Jr.
Assignee (at issue)
E.I. DU PONT DE NEMOURS AND COMPANY
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.