Granted Patent
Utility
US 4,451,973 · App. 06/367,809
Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
Inventors:
Kenichi Tateno, Masami Yokozawa, Hiroyuki Fujii, Mikio Nishikawa, Michio Katoh, Fujio Wada
Patented Case
View Patent ↗
Granted: Jun 5, 1984
Filed: Apr 13, 1982
Inventors
Kenichi Tateno
Masami Yokozawa
Hiroyuki Fujii
Mikio Nishikawa
Michio Katoh
Fujio Wada
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.