Granted Patent
Utility
US 4,465,549 · App. 06/574,169
Method of removing a glass backing plate from one major surface of a semiconductor wafer
Inventor:
Ira G. Ritzman
Patented Case
View Patent ↗
Granted: Aug 14, 1984
Filed: Jan 26, 1984
Inventor
Ira G. Ritzman
Assignee (at issue)
RCA Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.