IP Library › Granted Patent US 4,466,852
Granted Patent Utility
US 4,466,852 · App. 06/546,215

Method and apparatus for demounting wafers

Inventors: Richard K. Beltz, Donald M. Large, Daniel D. Leffel
Patented Case View Patent ↗
Granted: Aug 21, 1984 Filed: Oct 27, 1983
Inventors
Richard K. Beltz
Donald M. Large
Daniel D. Leffel
Assignee (at issue)
AT&T Technologies Incorporated

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Quick Facts
Patent No.
US 4,466,852
App. No.
06/546,215
Filed
1983-10-27
Granted
1984-08-21
Kind
A