Granted Patent
Utility
US 4,470,648 · App. 06/453,396
Interconnection construction to thick film substrate
Inventors:
Daniel Davis, Charles L. Henritzy
Patented Case
View Patent ↗
Granted: Sep 11, 1984
Filed: Dec 27, 1982
Inventors
Daniel Davis
Charles L. Henritzy
Assignee (at issue)
Ford Motor Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.