Granted Patent
Utility
US 4,508,161 · App. 06/585,819
Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
Inventor:
Scott C. Holden
Patented Case
View Patent ↗
Granted: Apr 2, 1985
Filed: Mar 2, 1984
Inventor
Scott C. Holden
Assignee (at issue)
Varian, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.