Granted Patent
Utility
US 4,512,509 · App. 06/469,662
Technique for bonding a chip carrier to a metallized substrate
Inventors:
Roland Ellis, Brian E. Jacobs, Edward J. March, Raymond J. Newman
Patented Case
View Patent ↗
Granted: Apr 23, 1985
Filed: Feb 25, 1983
Inventors
Roland Ellis
Brian E. Jacobs
Edward J. March
Raymond J. Newman
Assignee (at issue)
AT&T Technologies Incorporated
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.