Granted Patent
Utility
US 4,517,624 · App. 06/526,370
Device for cooling a plurality of integrated modules combined on a flexible printed circuitboard to form logic cards
Inventor:
Herrmann Wessely
Patented Case
View Patent ↗
Granted: May 14, 1985
Filed: Aug 25, 1983
Inventor
Herrmann Wessely
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.