IP Library Granted Patent US 4,528,259
Granted Patent Utility
US 4,528,259 · App. 06/550,379

Printed wiring boards with solder mask over bare copper wires having large area thickened circuit pad connections

Inventor: Donald F. Sullivan
Patented Case View Patent ↗
Granted: Jul 9, 1985 Filed: Nov 10, 1983
Inventor
Donald F. Sullivan

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

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Quick Facts
Patent No.
US 4,528,259
App. No.
06/550,379
Filed
1983-11-10
Granted
1985-07-09
Kind
A