Granted Patent
Utility
US 4,530,001 · App. 06/302,351
High voltage integrated semiconductor devices using a thermoplastic resin layer
Inventors:
Haruo Mori, Yasuo Ohno, Yutaka Ohta, Hiroshi Tanabe, Kotaro Kato
Patented Case
View Patent ↗
Granted: Jul 16, 1985
Filed: Sep 15, 1981
Inventors
Haruo Mori
Yasuo Ohno
Yutaka Ohta
Hiroshi Tanabe
Kotaro Kato
Assignees (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
Nippon Telegraph and Telephone Public Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.