Granted Patent
Utility
US 4,533,715 · App. 06/530,106
Single package epoxy resin system
Inventors:
Frank Wen-Chi Lee, Kenneth S. Baron
Patented Case
View Patent ↗
Granted: Aug 6, 1985
Filed: Sep 7, 1983
Inventors
Frank Wen-Chi Lee
Kenneth S. Baron
Assignee (at issue)
Hexcel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.