Granted Patent
Utility
US 4,533,934 · App. 06/192,961
Device structures for high density integrated circuits
Inventor:
Philip C. Smith
Patented Case
View Patent ↗
Granted: Aug 6, 1985
Filed: Oct 2, 1980
Inventor
Philip C. Smith
Assignee (at issue)
Westinghouse Electric Company LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.