Granted Patent
Utility
US 4,543,544 · App. 06/568,157
LCC co-planar lead frame semiconductor IC package
Inventor:
Bernhard A. Ziegner
Patented Case
View Patent ↗
Granted: Sep 24, 1985
Filed: Jan 4, 1984
Inventor
Bernhard A. Ziegner
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.