IP Library › Granted Patent US 4,558,345
Granted Patent Utility
US 4,558,345 · App. 06/546,181

Multiple connection bond pad for an integrated circuit device and method of making same

Inventors: Robert A. Dwyer, James E. Gillberg
Patented Case View Patent ↗
Granted: Dec 10, 1985 Filed: Oct 27, 1983
Inventors
Robert A. Dwyer
James E. Gillberg
Assignee (at issue)
RCA Corporation

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Quick Facts
Patent No.
US 4,558,345
App. No.
06/546,181
Filed
1983-10-27
Granted
1985-12-10
Kind
A