Granted Patent
Utility
US 4,576,322 · App. 06/650,445
Machine for ultrasonically bonding wires to cavity-down integrated circuit packages
Inventor:
Jorge Humberto Figueredo
Patented Case
View Patent ↗
Granted: Mar 18, 1986
Filed: Sep 14, 1984
Inventor
Jorge Humberto Figueredo
Assignee (at issue)
Burroughs, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.