Granted Patent
Utility
US 4,580,332 · App. 06/593,335
Forming a conductive, protective layer for multilayer metallization
Inventor:
Yan Borodovsky
Patented Case
View Patent ↗
Granted: Apr 8, 1986
Filed: Mar 26, 1984
Inventor
Yan Borodovsky
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.