Granted Patent
Utility
US 4,597,519 · App. 06/584,083
Lead wire bonding with increased bonding surface area
Inventors:
John A. Kurtz, Donald E. Cousens, Mark D. Dufour
Patented Case
View Patent ↗
Granted: Jul 1, 1986
Filed: Feb 27, 1984
Inventors
John A. Kurtz
Donald E. Cousens
Mark D. Dufour
Assignee (at issue)
Fairchild Camera & Instrument Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.