Granted Patent
Utility
US 4,598,166 · App. 06/638,176
High density multi-layer circuit arrangement
Inventor:
Wayne E. Neese
Patented Case
View Patent ↗
Granted: Jul 1, 1986
Filed: Aug 6, 1984
Inventor
Wayne E. Neese
Assignee (at issue)
GTE Communication Systems Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.