Granted Patent
Utility
US 4,611,238 · App. 06/754,686
Integrated circuit package incorporating low-stress omnidirectional heat sink
Inventors:
Terrence Evan Lewis, Stephen A. Smiley, Rex Rice, Zeev Lipkes, John A. Nelson
Patented Case
View Patent ↗
Granted: Sep 9, 1986
Filed: Jul 15, 1985
Inventors
Terrence Evan Lewis
Stephen A. Smiley
Rex Rice
Zeev Lipkes
John A. Nelson
Assignee (at issue)
Burroughs, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.