Granted Patent
Utility
US 4,622,574 · App. 06/759,728
Semiconductor chip with recessed bond pads
Inventor:
Enrique Q. Garcia
Patented Case
View Patent ↗
Granted: Nov 11, 1986
Filed: Jul 29, 1985
Inventor
Enrique Q. Garcia
Assignee (at issue)
PerkinElmer, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.