IP Library › Granted Patent US 4,624,749
Granted Patent Utility
US 4,624,749 · App. 06/771,712

Electrodeposition of submicrometer metallic interconnect for integrated circuits

Inventors: Jimmy C. Black, Bruce Edmunds Roberts, Dyer A. Matlock
Patented Case View Patent ↗
Granted: Nov 25, 1986 Filed: Sep 3, 1985
Inventors
Jimmy C. Black
Bruce Edmunds Roberts
Dyer A. Matlock
Assignee (at issue)
HARRIS CORPORATION

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Quick Facts
Patent No.
US 4,624,749
App. No.
06/771,712
Filed
1985-09-03
Granted
1986-11-25
Kind
A