Granted Patent
Utility
US 4,630,357 · App. 06/761,945
Method for forming improved contacts between interconnect layers of an integrated circuit
Inventors:
Steven Rogers, Thomas J. Hwang
Patented Case
View Patent ↗
Granted: Dec 23, 1986
Filed: Aug 2, 1985
Inventors
Steven Rogers
Thomas J. Hwang
Assignee (at issue)
NCR Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.