Granted Patent
Utility
US 4,637,130 · App. 06/692,385
Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
Inventors:
Hiroyuki Fujii, Kenichi Tateno, Mikio Nishikawa
Patented Case
View Patent ↗
Granted: Jan 20, 1987
Filed: Jan 17, 1985
Inventors
Hiroyuki Fujii
Kenichi Tateno
Mikio Nishikawa
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.