Granted Patent
Utility
US 4,643,935 · App. 06/819,995
Epoxy-glass integrated circuit package having bonding pads in a stepped cavity
Inventors:
Norman E. McNeal, Richárd Nagy, Ronald A. Norell
Patented Case
View Patent ↗
Granted: Feb 17, 1987
Filed: Jan 21, 1986
Inventors
Norman E. McNeal
Richárd Nagy
Ronald A. Norell
Assignee (at issue)
Burroughs, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.