Granted Patent
Utility
US 4,645,562 · App. 06/728,012
Double layer photoresist technique for side-wall profile control in plasma etching processes
Inventors:
Kuan-Yang Liao, Kuang-Yeh Chang, Hsing-Chien Ma
Patented Case
View Patent ↗
Granted: Feb 24, 1987
Filed: Apr 29, 1985
Inventors
Kuan-Yang Liao
Kuang-Yeh Chang
Hsing-Chien Ma
Assignee (at issue)
Hughes Aircraft Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.