Granted Patent
Utility
US 4,649,637 · App. 06/571,497
Method for producing resin-molded semiconductor device having heat radiating plate embedded in the resin
Inventor:
Mikio Hatakeyama
Patented Case
View Patent ↗
Granted: Mar 17, 1987
Filed: Jan 17, 1984
Inventor
Mikio Hatakeyama
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.