Granted Patent
Utility
US 4,655,134 · App. 06/756,461
Method of branding a semiconductor chip package
Inventor:
Charles Chen
Patented Case
View Patent ↗
Granted: Apr 7, 1987
Filed: Jul 18, 1985
Inventor
Charles Chen
Assignee (at issue)
Thomson Components-Moster Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.