IP Library › Granted Patent US 4,655,382
Granted Patent Utility
US 4,655,382 · App. 06/797,287

Materials for use in forming electronic interconnect

Inventors: Geoffrey Wong, Arthur W. Lopez, Jr.
Patented Case View Patent ↗
Granted: Apr 7, 1987 Filed: Nov 12, 1985
Inventors
Geoffrey Wong
Arthur W. Lopez, Jr.
Assignee (at issue)
Raychem Limited

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 4,655,382
App. No.
06/797,287
Filed
1985-11-12
Granted
1987-04-07
Kind
A