IP Library Granted Patent US 4,656,208
Granted Patent Utility
US 4,656,208 · App. 06/724,133

Thermosetting epoxy resin compositions and thermosets therefrom

Inventors: Sung G. Chu, Harold Jabloner, Brian J. Swetlin
Patented Case View Patent ↗
Granted: Apr 7, 1987 Filed: Apr 17, 1985
Inventors
Sung G. Chu
Harold Jabloner
Brian J. Swetlin
Assignee (at issue)
HERCULES LLC

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Quick Facts
Patent No.
US 4,656,208
App. No.
06/724,133
Filed
1985-04-17
Granted
1987-04-07
Kind
A