Granted Patent
Utility
US 4,662,124 · App. 06/610,925
Method of grinding a sapphire wafer
Inventors:
Ichiro Kato, Sigekazu Suzuki
Patented Case
View Patent ↗
Granted: May 5, 1987
Filed: May 15, 1984
Inventors
Ichiro Kato
Sigekazu Suzuki
Assignees (at issue)
Tokyo Shibaura Denki Kabushiki Kaisha
Toshiba Ceramics Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.