Granted Patent
Utility
US 4,680,613 · App. 06/557,119
Low impedance package for integrated circuit die
Inventors:
Wilbert E. Daniels, Dana Fraser
Patented Case
View Patent ↗
Granted: Jul 14, 1987
Filed: Dec 1, 1983
Inventors
Wilbert E. Daniels
Dana Fraser
Assignee (at issue)
FAIRCHILD SEMICONDUCTOR CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.