Granted Patent
Utility
US 4,684,055 · App. 06/771,846
Method of selectively soldering the underside of a substrate having leads
Inventors:
Scott D. Baer, Thomas P. Glenn
Patented Case
View Patent ↗
Granted: Aug 4, 1987
Filed: Sep 9, 1985
Inventors
Scott D. Baer
Thomas P. Glenn
Assignee (at issue)
HARRIS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.