Granted Patent
Utility
US 4,692,839 · App. 06/748,087
Multiple chip interconnection system and package
Inventors:
James Cheng Lee, Richard L. Beck, Francisca Tung
Patented Case
View Patent ↗
Granted: Sep 8, 1987
Filed: Jun 24, 1985
Inventors
James Cheng Lee
Richard L. Beck
Francisca Tung
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.