Granted Patent
Utility
US 4,696,833 · App. 06/794,311
Method for applying a uniform coating to integrated circuit wafers by means of chemical deposition
Inventors:
Kenneth A. Monnig, David Quint
Patented Case
View Patent ↗
Granted: Sep 29, 1987
Filed: Oct 30, 1985
Inventors
Kenneth A. Monnig
David Quint
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.