IP Library Granted Patent US 4,708,967
Granted Patent Utility
US 4,708,967 · App. 06/843,949

Thermosetting resin binder particles and methods for making waferboard

Inventors: Rudolph Ferentchak, James F. Kozischek, Jerome E. Schwartz
Patented Case View Patent ↗
Granted: Nov 24, 1987 Filed: Mar 25, 1986
Inventors
Rudolph Ferentchak
James F. Kozischek
Jerome E. Schwartz
Assignee (at issue)
Reheis Chemical Company, Inc.

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Quick Facts
Patent No.
US 4,708,967
App. No.
06/843,949
Filed
1986-03-25
Granted
1987-11-24
Kind
A