Granted Patent
Utility
US 4,714,516 · App. 06/912,455
Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging
Inventors:
Charles W. Eichelberger, Robert J. Wojnarowski
Patented Case
View Patent ↗
Granted: Dec 22, 1987
Filed: Sep 26, 1986
Inventors
Charles W. Eichelberger
Robert J. Wojnarowski
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.