IP Library Granted Patent US 4,719,124
Granted Patent Utility
US 4,719,124 · App. 06/851,255

Low temperature deposition utilizing organometallic compounds

Inventors: Po-Yen Lu, Chi-Hua Wang, Larry M. Williams
Patented Case View Patent ↗
Granted: Jan 12, 1988 Filed: Jul 28, 1986
Inventors
Po-Yen Lu
Chi-Hua Wang
Larry M. Williams
Assignee (at issue)
American Telephone and Telegraph Company, AT&T Bell Laboratories

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Quick Facts
Patent No.
US 4,719,124
App. No.
06/851,255
Filed
1986-07-28
Granted
1988-01-12
Kind
A